Edwards iXH 1210H HARSH Dry Vacuum Pump 200-230 VAC 50/60 hz 3 ph. PN AC3A0A122200

The Edwards iXH 1210H is a new range of dry pumps built for green manufacturing and the processing of harsh chemical processes. Using very low energy the efficient roots mechanism has been developed to dramatically reduce input power to 1.3 kW, 60% lower than the previous generation of dry pumps, reducing environmental impact and lowering cost of ownership. Gas barrier technology and thermal design improvements enable four times greater corrosion resistance than iH Series product. Advanced powder handling features mean iXH will deliver maximum reliability and extended pump life for multi-layer etch processes and reduced power consumption for CVD processes especially with HARSH Chemicals.

The Edwards iXH 1210H Series Pumps are compact and of light-weight design, combined with exceptionally low noise and vibration, makes iXH the most versatile chemical dry pump in the Edwards range. iXH will transform your expectations of dry vacuum pump technology, deliver real benefits and increased uptime, with minimal environmental impact. iXH pumps are designed for use in most semiconductor processes while delivering significant reductions in input power. For complete Instruction Manual see Downloads to the side.

FEATURES and BENEFITS:

• Primarily for HARSH Chemical Applications
• Peak Pumping Speed 1025 m3/h-1 (603 CFM)
• Ultimate Pressure 5.0 X 10-3 Torr
• No preventative maintenance required
• 3/8 inch Quick Connect Water Fillings
• Water & Power Connection Mating Halves
• SS Water Cooling System
• Multi Mode 44 slm Gas Module

APPLICATIONS:

• Load Lock
• Transfer
• Meteorology
• Lithography
• Physical Vapor Deposition PVD Process
• Physical Vapor Deposition PVD Pre-clean
• Rapid Thermal Anneal RTA
• Strip/Ashing
• Etching
• Implant Source
• High-Density Plasma Chemical Vapor Deposition HDP CVD
• Rapid Thermal Processing RTP
• Sub-Atmospheric Chemical Vapor Deposition SACVD
• Tungsten Chemical Vapor Deposition WCVD
• Modified Chemical-Vapor Deposition MCVD
• Plasma-Enhanced Chemical Vapor Deposition PECVD
• Low Pressure Chemical Vapor Deposition LPCVD