Ideal Vacuum Circular Magnetron Sputtering Targets, ALUMINUM OXIDE- Al₂O₃ Sputtering Target, 3'' Diameter x 0.125" Thick, 99.99 Percent Purity, Metallic Bonded to a OFHC Copper Backing Plate

This product is a circular magnetron ALUMINUM OXIDE- Al₂O₃ sputtering target, with a 3'' diameter x 0.125" thickness. It is 99.99% pure, and is metallically bonded to a OFHC (Oxygen-Free High Conductivity) copper backing plate.

We use a very competitive pricing strategy to ensure you receive the highest quality products at the best possible value, giving you both affordability and excellence in every purchase. We offer huge discounts to every customer, customers who place bulk orders will enjoy huge savings. We stock huge quantities of our products to give our customers guaranteed same day shipping after placing an order. This short lead time is loved by all our customers who look to manage their cash flow with quicker turnaround times. Our regular customers can maintain lower inventory levels, decreasing storage costs and minimizing the risk of obsolescence. Buying from Ideal Vacuum means a customer receives their product more quickly, enhancing satisfaction and meeting their urgent needs. This also enables our customers to stay ahead of their competition by quickly adapting to new trends and demands.

ALUMINUM OXIDE- Al₂O₃

1. Refractive Index: Refractive Index: ~1.63 (at 550 nm), making it a low to medium-index material. This property makes it suitable for use in multilayer optical coatings, such as anti-reflective coatings, dielectric mirrors, and filters.

2. Optical Transparency: Transmission Window: Al₂O₃ is highly transparent from the ultraviolet (UV) to the infrared (IR) range, from ~200 nm to ~5 µm. This makes it suitable for a variety of optical applications in UV, visible, and IR wavelengths.

3. Mechanical Properties: Al₂O₃ is extremely hard and wear-resistant, making it an excellent choice for protective coatings and abrasion-resistant layers on surfaces subject to mechanical stress. Its high mechanical strength also makes it suitable for microelectronic and protective coatings in harsh environments.

4. Chemical and Thermal Stability: Al₂O₃ is highly chemically inert and resistant to corrosion and oxidation, making it suitable for use in chemically harsh environments. It has high thermal stability, making it useful in high-temperature applications.

5. Dielectric Properties: High Dielectric Constant: Al₂O₃ has a relatively high dielectric constant (~9), which makes it useful as a gate dielectric and in capacitors for electronic applications. It serves as an excellent insulating layer in semiconductor devices, providing good electrical insulation and thermal stability.

6. Deposition Methods: Al₂O₃ thin films can be deposited by a variety of methods, including RF sputtering, reactive sputtering, atomic layer deposition (ALD), and thermal evaporation. ALD is particularly favored for ultra-thin, conformal coatings in semiconductor and nanotechnology applications.

7. Applications: Optical Coatings: Al₂O₃ is commonly used in anti-reflective coatings, protective coatings on optics, and as a part of multilayer dielectric mirrors. Microelectronics: Al2O3 is widely used in MOSFETs as a gate insulator, in capacitors, and as a passivation layer in semiconductor devices. Protective Coatings: Due to its hardness and resistance to wear and chemicals, it is used to protect surfaces in industrial applications. Barrier Coatings: Al₂O₃ provides an excellent diffusion barrier and is used in packaging and moisture protection layers.

Summary:
Aluminum Oxide (Al₂O₃ ) is a versatile material in thin films, offering optical transparency, mechanical durability, chemical inertness, and dielectric properties. It is widely used in optical coatings, microelectronics, protective layers, and barrier coatings, with applications ranging from semiconductor devices to abrasion-resistant coatings and optical elements. Its combination of transparency and stability makes it a critical material for high-performance coatings across various industries.

Notes:
Metallic or elastomer backing plate bonding is recommended for all dielectric target materials because these materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. These targets are most susceptible to thermal shock due to their low thermal conductivity and hence, may require specific power ramp up and ramp down procedures during start up and shut down steps.