Home >

ExploraVAC Vacuum Chambers >

ExploraVAC PVD Systems >

PVD Sputtering Targets >

Ideal Vacuum Circular Magnetron Sputtering Targets, ZIRCONIUM DIOXIDE - ZrO₂ Sputtering Target, 3'' Diameter x 0.125" Thick, 99.99 Percent Purity, Metallic Bonded to a OFHC Copper Backing Plate

Load

NEW ITEM

Ideal Vacuum Circular Magnetron Sputtering Targets, ZIRCONIUM DIOXIDE - ZrO₂ Sputtering Target, 3'' Diameter x 0.125" Thick, 99.99 Percent Purity, Metallic Bonded to a OFHC Copper Backing Plate

Condition:

New

Part Number:

P1013708

Warranty:

Full Manufacturer's Warranty

Available Now 1

Sale: $2,030.00

Currency: US Dollar (USD)

Description

Ideal Vacuum Circular Magnetron Sputtering Targets, ZIRCONIUM OXIDE - ZrO₂ Sputtering Target, 3'' Diameter x 0.125" Thick, 99.99 Percent Purity, Metallic Bonded to a OFHC Copper Backing Plate
Ideal Vacuum Products, LLC.

This product is a circular magnetron ZrO₂ sputtering target, with a 3'' diameter x 0.125" thickness. It is 99.99% pure, and is metallically bonded to a OFHC (Oxygen-Free High Conductivity) copper backing plate

We use a very competitive pricing strategy to ensure you receive the highest quality products at the best possible value, giving you both affordability and excellence in every purchase. We offer huge discounts to every customer, customers who place bulk orders will enjoy huge savings. We stock huge quantities of our products to give our customers guaranteed same day shipping after placing an order. This short lead time is loved by all our customers who look to manage their cash flow with quicker turnaround times. Our regular customers can maintain lower inventory levels, decreasing storage costs and minimizing the risk of obsolescence. Buying from Ideal Vacuum means a customer receives their product more quickly, enhancing satisfaction and meeting their urgent needs. This also enables our customers to stay ahead of their competition by quickly adapting to new trends and demands.

Zirconium Oxide
Zirconium dioxide (ZrO₂), also known as zirconia, is an inorganic compound composed of zirconium and oxygen. It is a white, crystalline solid that is known for its exceptional hardness, chemical stability, and high melting point. ZrO2 is widely used in various industrial and scientific applications due to its robust physical properties and versatility.

Zirconium dioxide (ZrO₂) is widely used in thin film coatings for its exceptional thermal, chemical, and optical properties. Its high refractive index, chemical stability, and mechanical durability make it an ideal material for a variety of advanced thin film applications. Below are the main uses of ZrO₂ in thin film coatings:

1. Optical Coatings.
2. Dielectric Layers.
3.Protective and Barrier Coatings
4. Thermal Barrier Coatings.

Zirconium dioxide thin films are utilized in a wide range of advanced applications, including optical devices, microelectronics, protective coatings, and high-temperature systems, due to their unique combination of high refractive index, dielectric strength, and thermal stability.

RF vs DC Sputtering:
RF sputtering is often the preferred method for sputtering pure metallic oxides because they are insulators and RF has an alternating electric field that prevents charge buildup on the target surface. This alternating field reduces the charge accumulation that would otherwise cause arcing in DC sputtering.

Deposition rate:
Lower deposition rate: In RF sputtering, the power transfer to the plasma is less efficient compared to DC, primarily due to the alternating nature of the electric field. This results in a lower deposition rate compared to DC sputtering under equivalent power conditions.

Target Material:
For conductive targets (like titanium in reactive sputtering), DC sputtering has a higher deposition rate. For insulating targets like pure metal oxides, RF sputtering must be used, and deposition rates are typically lower.

Power Levels:
Increasing the power can increase deposition rates in both RF and DC sputtering, but deposition rates still tend to be higher in DC for conductive materials.

Pressure and Gas Flow:
Higher deposition rates can be achieved by optimizing the gas pressure and flow, with different optimal conditions for RF vs. DC.

Notes:
Metallic or elastomer backing plate bonding is recommended for all dielectric target materials because these materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. These targets are most susceptible to thermal shock due to their low thermal conductivity and hence, may require specific power ramp up and ramp down procedures during start up and shut down steps.