Agilent Varian Titanium Sublimation Pumps (TSP) Filament 2.75 in Conflat Flange. PN 9160050

The TSP cartridge is provided on a 2-3⁄4 in OD ConFlat flange and contains three titanium-molybdenum filaments, each with 1.1 grams of usable titanium. The cartridge assembly is bakeable to 400° C. Maximum. Titanium sublimation pumps (TSPs) are typically used as an effective way to pump getterable gases such as hydrogen and nitrogen in UHV systems. TSPs are often combined with ion pumping, since the ion pump is effective with non-getterable UHV gases such as argon and methane. The TSP can be added to the inside of the ion pump, or as a separate pumping unit. If the TSP is used in conjunction with a liquid nitrogen-cooled cryopanel, extra high water pumping speed will be achieved.

Varian offers two different types of titanium sublimation pumps: filament and titanium ball sources. Filament-type TSP sources are most popular with UHV systems since they can be turned off between sublimations and thus do not add thermally-induced outgassing. The ball-type sources contain larger amounts of titanium which means longer life when operated under conditions that use more titanium, such as higher operating pressures. However, the ball sources require standby power between sublimations to prevent cracks from forming in the titanium ball. The factors affecting titanium sublimation pumping efficiency include sublimation rate, frequency, surface area, and temperature. Sublimation pumping speed is generally a constant value below 10^-7 mbar.