Ideal Vacuum COPPER Pellets - Cu, 250 Grams, 99.999 Percent - 5N Pure, 6 x 6 mm Pellets, Copper Melting Point 1,083°C, PVD Evaporation Materials, Thin Films Deposition Materials

If you are looking for high quality PVD evaporation materials for your process, you have come to the right place, your search ends here. This product is a bottle of 250 grams of high purity copper (Cu) pellets (99.999%) that are 6 x 6 mm in size and ships in PET plastic or glass bottles. These pellets have a density of 8.92 g/cc, a melting point of 1083°C, and a vapor pressure of 10-4 Torr at 1,017°C. Its coefficient of thermal expansion is 16.5 x 10-6/K, and in context of thin films deposition, it has a Z ratio of 0.437.

We use a very competitive pricing strategy to ensure you receive the highest quality products at the best possible value, giving you both affordability and excellence in every purchase. We offer huge discounts to every customer, customers who place bulk orders will enjoy huge savings. We stock huge quantities of our products to give our customers guaranteed same day shipping after placing an order. This short lead time is loved by all our customers who look to manage their cash flow with quicker turnaround times. Our regular customers can maintain lower inventory levels, decreasing storage costs and minimizing the risk of obsolescence. Buying from Ideal Vacuum means a customer receives their product more quickly, enhancing satisfaction and meeting their urgent needs. This also enables our customers to stay ahead of their competition by quickly adapting to new trends and demands.

Price Match Guarantee
We are committed to providing you with the best value for your purchase. If you find a lower price on an identical item from a competitor, we will match that price. Just provide us with the relevant details, and we’ll ensure you get a better deal.

Copper
Copper is a chemical element with the symbol Cu and atomic number 29. It is a reddish-gold metal that is highly conductive of electricity and heat. It has a density of 8.92 g/cc, a melting point of 1083°C, and a vapor pressure of 10-4 Torr at 1,017°C. Its coefficient of thermal expansion is 16.5 x 10-6/K, and in context of thin films deposition, it has a Z ratio of 0.437.

Copper is widely used in the thin film industry due to its excellent electrical conductivity, thermal properties, and adhesion characteristics. It can be melted and evaporated using E-beam evaporation or resistive heating in crucibles, evaporation boats and wire baskets. Below are a few examples where copper thin films are utilized.